IMR OpenIR
Creep rupture Behavior of K40S alloy at elevated temperatures
F. M. Yang; X. F. Sun; H. R. Guan; Z. Q. Hu
2004
发表期刊Journal of Materials Science & Technology
ISSN1005-0302
卷号20期号:2页码:175-179
摘要Creep testing was conducted on K40S alloy. The detailed creep deformation and fracture mechanisms under constant load were studied. The results show that the stress exponent ranges between 7 and 14.4 at elevated temperature 973similar to1173 K, and that the activation energy is approximately 449.1 kJ/mol. During creep, the grain boundary sliding cut off primary carbides at the boundary, generating the "O" model cracks. The creep failure mode of K40S alloy is transgranular ductile and cracks originate at the primary carbides. A long carbide and matrix interface is often a preferential path for crack propagation. The creep mechanism is discussed in light of the creep microstructure, the stress exponent and the activation energy.
部门归属chinese acad sci, inst met res, shenyang 110016, peoples r china.;yang, fm (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china;fuminyang@sohu.com
关键词K40s Alloy Creep Fracture Crack Propagation Activation-energies Superalloy Term
URL查看原文
WOS记录号WOS:000220705300013
引用统计
被引频次:1[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/35663
专题中国科学院金属研究所
推荐引用方式
GB/T 7714
F. M. Yang,X. F. Sun,H. R. Guan,et al. Creep rupture Behavior of K40S alloy at elevated temperatures[J]. Journal of Materials Science & Technology,2004,20(2):175-179.
APA F. M. Yang,X. F. Sun,H. R. Guan,&Z. Q. Hu.(2004).Creep rupture Behavior of K40S alloy at elevated temperatures.Journal of Materials Science & Technology,20(2),175-179.
MLA F. M. Yang,et al."Creep rupture Behavior of K40S alloy at elevated temperatures".Journal of Materials Science & Technology 20.2(2004):175-179.
条目包含的文件
条目无相关文件。
个性服务
推荐该条目
保存到收藏夹
查看访问统计
导出为Endnote文件
谷歌学术
谷歌学术中相似的文章
[F. M. Yang]的文章
[X. F. Sun]的文章
[H. R. Guan]的文章
百度学术
百度学术中相似的文章
[F. M. Yang]的文章
[X. F. Sun]的文章
[H. R. Guan]的文章
必应学术
必应学术中相似的文章
[F. M. Yang]的文章
[X. F. Sun]的文章
[H. R. Guan]的文章
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。