| Novel crosslinking of high-order and multiple copper twins in advanced microelectronics packaging | |
| W. Zhang; C. Z. Liu; D. X. Li; M. L. Sui | |
| 2004 | |
| Source Publication | Advanced Engineering Materials
 |
| ISSN | 1438-1656 |
| Volume | 6Issue:4Pages:232-234 |
| description.department | chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, w (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 77 wenhua rd, shenyang 110016, peoples r china;wzhang@imr.ac.cn mlsui@imr.ac.cn |
| Keyword | Nanocrystalline Copper Deformation Twins Temperature Strain Growth Cu |
| URL | 查看原文 |
| WOS ID | WOS:000221403600013 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/35722 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | W. Zhang,C. Z. Liu,D. X. Li,et al. Novel crosslinking of high-order and multiple copper twins in advanced microelectronics packaging[J]. Advanced Engineering Materials,2004,6(4):232-234. |
| APA | W. Zhang,C. Z. Liu,D. X. Li,&M. L. Sui.(2004).Novel crosslinking of high-order and multiple copper twins in advanced microelectronics packaging.Advanced Engineering Materials,6(4),232-234. |
| MLA | W. Zhang,et al."Novel crosslinking of high-order and multiple copper twins in advanced microelectronics packaging".Advanced Engineering Materials 6.4(2004):232-234. |
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