Critical shear stress for onset of plasticity in a nanocrystalline Cu determined by using nanoindentation | |
J. Chen; W. Wang; L. H. Qian; K. Lu | |
2003 | |
发表期刊 | Scripta Materialia
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ISSN | 1359-6462 |
卷号 | 49期号:7页码:645-650 |
摘要 | The plastic deformation behavior was investigated by using nanoindentation in a magneto-sputtered nanocrystalline (nc) Cu film with an average grain size of 14 mn. The determined critical shear stress to initiate plasticity in the nc-Cu sample (about 8.3 GPa) is identical to that for nucleation of lattice dislocations in an annealed coarse-grained Cu (8.5 GPa), and both values are close to the theoretical shear strength in the dislocation-free single crystal. This observation, in agreement with the atomistic simulation results, supports the argument that the onset of plasticity of the nc-Cu is associated with initiation of dislocation activities at grain boundaries. (C) 2003 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
部门归属 | chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china.;lu, k (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china |
关键词 | Nanoindentation Nanocrystalline Copper Plastic Deformation Dislocation Copper Thin-films Polycrystalline Materials Deformation Indentation Creep |
URL | 查看原文 |
WOS记录号 | WOS:000184618300004 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/35799 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | J. Chen,W. Wang,L. H. Qian,et al. Critical shear stress for onset of plasticity in a nanocrystalline Cu determined by using nanoindentation[J]. Scripta Materialia,2003,49(7):645-650. |
APA | J. Chen,W. Wang,L. H. Qian,&K. Lu.(2003).Critical shear stress for onset of plasticity in a nanocrystalline Cu determined by using nanoindentation.Scripta Materialia,49(7),645-650. |
MLA | J. Chen,et al."Critical shear stress for onset of plasticity in a nanocrystalline Cu determined by using nanoindentation".Scripta Materialia 49.7(2003):645-650. |
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