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Inhibition effect of allylthiourea and 1-dodecanethiol on copper corrosion
C. T. Wang; S. H. Chen; S. Y. Zhao; D. G. Li
2003
Source PublicationActa Chimica Sinica
ISSN0567-7351
Volume61Issue:2Pages:151-155
AbstractSelf-assembled monolayer of allylthiourea (AT) was first formed on copper surface. 1-Dodecanethiol (DT) was then self-assembled on the surface for subsequent modification: Finally, AC voltage was loaded on copper covered with the mixed film for further improvement. After these processes, an effective inhibition film was obtained as indicated by the high charge-transfer resistance shown in electrochemical impedance spectroscopy and low corrosion current density in polarization curves. The maximum coverage and inhibition efficiency for copper corrosion was 98.6% and 98.5%, respectively. The mixed film was stable in a wide range of potential before and after AC voltage treatment.
description.departmentshandong univ, sch chem & chem engn, jinan 250100, peoples r china. state key lab corros & protect, shenyang 110015, peoples r china.;chen, sh (reprint author), shandong univ, sch chem & chem engn, jinan 250100, peoples r china
KeywordSelf-assembly Electrochemical Impedance Spectroscopy Ac Treatment Inhibition Efficiency Self-assembled Monolayers Impedance Spectroscopy Acid-solution Gold Protection Alkanethiols Electrode Thiourea Electrodissolution Mechanisms
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WOS IDWOS:000181172200001
Citation statistics
Cited Times:11[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/36040
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
C. T. Wang,S. H. Chen,S. Y. Zhao,et al. Inhibition effect of allylthiourea and 1-dodecanethiol on copper corrosion[J]. Acta Chimica Sinica,2003,61(2):151-155.
APA C. T. Wang,S. H. Chen,S. Y. Zhao,&D. G. Li.(2003).Inhibition effect of allylthiourea and 1-dodecanethiol on copper corrosion.Acta Chimica Sinica,61(2),151-155.
MLA C. T. Wang,et al."Inhibition effect of allylthiourea and 1-dodecanethiol on copper corrosion".Acta Chimica Sinica 61.2(2003):151-155.
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