Microstructural characteristics by EBSD and ECC in ECAE processed pure Cu samples

IMR OpenIR

	Microstructural characteristics by EBSD and ECC in ECAE processed pure Cu samples
	G. Wang; S. D. Wu; C. Esling; G. Y. Li; L. Zuo; Z. G. Wang
	2003
发表期刊	Advanced Engineering Materials
ISSN	1438-1656
卷号	5 期号:8 页码:593-597
部门归属	northeastern univ, key lab epm, minist educ, shenyang 110004, peoples r china. chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. univ metz, cnrs umr 7078, isgmp, lab etud text & applicat mat, f-57012 metz, france.;wang, g (reprint author), northeastern univ, key lab epm, minist educ, shenyang 110004, peoples r china
关键词	Electron Channeling Contrast Enhanced Grain-growth Al-mg Alloy Angular Extrusion Deformation Copper Size
URL	查看原文
WOS记录号	WOS:000185046100020
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/36043
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	G. Wang,S. D. Wu,C. Esling,et al. Microstructural characteristics by EBSD and ECC in ECAE processed pure Cu samples[J]. Advanced Engineering Materials,2003,5(8):593-597.
APA	G. Wang,S. D. Wu,C. Esling,G. Y. Li,L. Zuo,&Z. G. Wang.(2003).Microstructural characteristics by EBSD and ECC in ECAE processed pure Cu samples.Advanced Engineering Materials,5(8),593-597.
MLA	G. Wang,et al."Microstructural characteristics by EBSD and ECC in ECAE processed pure Cu samples".Advanced Engineering Materials 5.8(2003):593-597.