Microstructure, texture, grain boundaries in recrystallization regions in pure Cu ECAE samples

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	Microstructure, texture, grain boundaries in recrystallization regions in pure Cu ECAE samples
	G. Wang; S. D. Wu; L. Zuo; C. Esling; Z. G. Wang; G. Y. Li
	2003
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093
卷号	346 期号:1-2 页码:83-90
摘要	By means of equal channel angular extrusion (ECAE), pure Cu single crystal samples were processed down to the submicron scale. In some parts of the samples, recrystallization occurs at room temperature. The recrystallization mechanism was analyzed by SEM-EBSP and SEM-ECC techniques. The grain boundary character distribution (GBCD) and orientation distribution function (ODF) of the regions undergoing recrystallization were computed. The results show that the nuclei can be formed at the intersections of two different shear bands, and the microstructures and the grain boundary characters in these locations contribute to growth of recrystallized nuclei. The recrystallized grains had grown according to the Feltham's mechanism. (C) 2002 Elsevier Science B.V. All rights reserved.
部门归属	northeastern univ, sch met & mat, shenyang 110004, peoples r china. chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. univ metz, lab etud textures & applicat mat, cnrs, umr 7078,isgmp, f-57012 metz, france.;wang, g (reprint author), northeastern univ, sch met & mat, shenyang 110004, peoples r china
关键词	Microstructure Texture Grain Boundaries Grain Growth Ecae Cu Electron Channeling Contrast Al-mg Alloy Nanocrystalline Materials Plastic-deformation Thermal-stability Angular Extrusion Copper Growth Metals Diffraction
URL	查看原文
WOS记录号	WOS:000180817700011
引用统计	被引频次：62[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/36044
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	G. Wang,S. D. Wu,L. Zuo,et al. Microstructure, texture, grain boundaries in recrystallization regions in pure Cu ECAE samples[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2003,346(1-2):83-90.
APA	G. Wang,S. D. Wu,L. Zuo,C. Esling,Z. G. Wang,&G. Y. Li.(2003).Microstructure, texture, grain boundaries in recrystallization regions in pure Cu ECAE samples.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,346(1-2),83-90.
MLA	G. Wang,et al."Microstructure, texture, grain boundaries in recrystallization regions in pure Cu ECAE samples".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 346.1-2(2003):83-90.