| Microsample tensile testing of nanocrystalline copper | |
| Y. M. Wang; K. Wang; D. Pan; K. Lu; K. J. Hemker; E. Ma | |
| 2003 | |
| Source Publication | Scripta Materialia
 |
| ISSN | 1359-6462 |
| Volume | 48Issue:12Pages:1581-1586 |
| Abstract | The tensile properties of nanocrystalline copper with grain sizes <100 nm produced by surface mechanical attrition treatment have been characterized using a microsample testing technique. The nanocrystalline copper exhibits a yield strength as high as 760 MPa, with a small elongation to failure. Factors leading to the high strength and low ductility are discussed. (C) 2003 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved. |
| description.department | johns hopkins univ, dept mat sci & engn, baltimore, md 21218 usa. chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china. johns hopkins univ, dept mech engn, baltimore, md 21218 usa.;wang, ym (reprint author), johns hopkins univ, dept mat sci & engn, 3400 n charles st, baltimore, md 21218 usa |
| Keyword | Nanocrystalline Materials Strength Ductility Fracture Copper Mechanical-behavior Metals Microstructure Ductility Strength Fatigue Alloy Cu |
| URL | 查看原文 |
| WOS ID | WOS:000182779200003 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/36065 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | Y. M. Wang,K. Wang,D. Pan,et al. Microsample tensile testing of nanocrystalline copper[J]. Scripta Materialia,2003,48(12):1581-1586. |
| APA | Y. M. Wang,K. Wang,D. Pan,K. Lu,K. J. Hemker,&E. Ma.(2003).Microsample tensile testing of nanocrystalline copper.Scripta Materialia,48(12),1581-1586. |
| MLA | Y. M. Wang,et al."Microsample tensile testing of nanocrystalline copper".Scripta Materialia 48.12(2003):1581-1586. |
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