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Microstructure and thermal stability of an ultrafine Al/Al2O3 composite
Z. Q. Yang; L. L. He; J. Chen; H. T. Cong; H. Q. Ye
2003
发表期刊Journal of Materials Research
ISSN0884-2914
卷号18期号:2页码:272-278
摘要Studies were carried out on the microstructure and thermal stability of an ultrafine Al/Al2O3 composite with high strength and low density. Transmission electron microscopy indicated that Al2O3 shells remained undeformed below 550 degreesC, which limited grain growth of Al. Both transmission electron microscopy and x-ray diffraction analysis indicated that no obvious grain growth of Al with time occurred upon annealing at 620 degreesC. After almost all the alumina shells were destroyed following annealing at 620 degreesC, the Al2O3 fragments with various morphologies distributed in the material could still limit the migration of Al grain boundaries to increase the thermal stability of the material. After Al melted and resolidified, the grain sizes of Al were still about 200 run. The bulk composite sample showed good dimensional stability. Even if the Al grains melted, the network of Al2O3 fragments kept the sample from deforming due to the wetting of Al2O3 network with liquid Al.
部门归属chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china.;yang, zq (reprint author), chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china
关键词Nanocrystalline Materials Consolidated Composites Aluminum Al Matrix
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WOS记录号WOS:000180889900006
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被引频次:14[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/36126
专题中国科学院金属研究所
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Z. Q. Yang,L. L. He,J. Chen,et al. Microstructure and thermal stability of an ultrafine Al/Al2O3 composite[J]. Journal of Materials Research,2003,18(2):272-278.
APA Z. Q. Yang,L. L. He,J. Chen,H. T. Cong,&H. Q. Ye.(2003).Microstructure and thermal stability of an ultrafine Al/Al2O3 composite.Journal of Materials Research,18(2),272-278.
MLA Z. Q. Yang,et al."Microstructure and thermal stability of an ultrafine Al/Al2O3 composite".Journal of Materials Research 18.2(2003):272-278.
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