Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films

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	Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films
	G. P. Zhang; R. Schwaiger; C. A. Volkert; O. Kraft
	2003
发表期刊	Philosophical Magazine Letters
ISSN	0950-0839
卷号	83 期号:8 页码:477-483
摘要	This letter presents systematic experimental observations of fatigue damage and corresponding dislocation structures in thin Cu films as a function of film thickness made using transmission electron microscopy and focused-ion-beam microscopy. It is found that, in thick films and grains of at least 3.0 mum diameter, coarse surface extrusions and dislocation wall and cell structures occur whereas, in thin films or in small-diameter grains, finer extrusions occur but no clearly defined dislocation structures are present. This minimum required dimension of 3.0 mum for fatigue damage formation may be caused by constrained dislocation motion in small dimensions.
部门归属	max planck inst met res, d-70569 stuttgart, germany. chinese acad sci, shenyang natl lab mat sci, met res inst, shenyang 110016, peoples r china. forschungszentrum karlsruhe, inst mat forsch 2, d-76021 karlsruhe, germany.;zhang, gp (reprint author), max planck inst met res, heisenbergstr 3, d-70569 stuttgart, germany
关键词	Cycle Fatigue Copper-films Deformation Behavior
URL	查看原文
WOS记录号	WOS:000184576200002
引用统计	被引频次：75[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/36153
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	G. P. Zhang,R. Schwaiger,C. A. Volkert,et al. Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films[J]. Philosophical Magazine Letters,2003,83(8):477-483.
APA	G. P. Zhang,R. Schwaiger,C. A. Volkert,&O. Kraft.(2003).Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films.Philosophical Magazine Letters,83(8),477-483.
MLA	G. P. Zhang,et al."Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films".Philosophical Magazine Letters 83.8(2003):477-483.