Evolution of microstructures in materials induced by electropulsing | |
W. Zhang; M. L. Sui; Y. Z. Zhou; D. X. Li | |
2003 | |
发表期刊 | Micron
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ISSN | 0968-4328 |
卷号 | 34期号:3-5页码:189-198 |
摘要 | Nanostructures were formed in several conventional materials under single electropulsing, that is nanophases of alpha-Cu(Zn) and beta'-(CuZn) in a cold-worked alpha-Cu(Zn) alloy, nanosized gamma-Fe in a low-carbon steel, nanosized alpha-Al in a superduralumin, and orientated nanosized TiC in a TiC/NiCr cermet. The mechanisms responsible for the above nanostructured transitions can be attributed to the competition of many factors induced by electropulsing, including high-rate heating, thermal stress, reduced thermodynamic energy barrier and high-rate electron impacting. Also, many low-energy dislocation configurations, twins and stacking faults were formed in the copper alloy and cermet under the electropulsing. Such evolution of defects was associated with the electrical, thermal and stress energies induced by the electropulsing. (C) 2003 Elsevier Ltd. All rights reserved. |
部门归属 | chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. chinese acad sci, inst met res, int ctr mat phys, shenyang 110016, peoples r china.;li, dx (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china |
关键词 | Electropulsing Nanostructure Dislocation Twin Electric-current Pulses Recrystallization Conductors Prediction Zirconium Copper Model |
URL | 查看原文 |
WOS记录号 | WOS:000184846600009 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/36180 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | W. Zhang,M. L. Sui,Y. Z. Zhou,et al. Evolution of microstructures in materials induced by electropulsing[J]. Micron,2003,34(3-5):189-198. |
APA | W. Zhang,M. L. Sui,Y. Z. Zhou,&D. X. Li.(2003).Evolution of microstructures in materials induced by electropulsing.Micron,34(3-5),189-198. |
MLA | W. Zhang,et al."Evolution of microstructures in materials induced by electropulsing".Micron 34.3-5(2003):189-198. |
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