Grain boundary triple junction effects on the fatigue deformation and cracking Behaviors of copper tricrystal and tetracrystals

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	Grain boundary triple junction effects on the fatigue deformation and cracking Behaviors of copper tricrystal and tetracrystals
	W. P. Jia; Z. Y. Zhu; Z. G. Wang; S. X. Li
	2002
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	18 期号:2 页码:108-112
摘要	Cyclic symmetrical tension-compression fatigue tests in an axial plastic strain range of 2.0X10(-4) to 1.5X10(-3) were performed on three copper tetracrystal specimens containing two grain boundary triple lines as well as one copper tricrystal specimen employing a multiple step method. Experimental results show that the strengthening effect of triple junction (TJ) on axial saturation stress increased with increasing plastic strain amplitude. The strengthening effects owe much to the strain incompatibilities at TJ. The cyclic stress-strain (CSS) curves of tetracrystals are higher than that of tricrystal. At low strain amplitude, deformation at TJ is smaller than that near grain boundary (GB), which results in that the width of TJ effect zone is smaller than that near GB. Whether GB split or not is associated with the angle between GB and loading axis, activation of slip systems beside GB and the accommodation and annihilation of residual dislocations on GB planes.
部门归属	chinese acad sci, met res inst, state key lab corros & protect met, shenyang 110016, peoples r china. chinese acad sci, met res inst, state key lab fatigue & fracture mat, shenyang 110016, peoples r china.;jia, wp (reprint author), chinese acad sci, met res inst, state key lab corros & protect met, shenyang 110016, peoples r china
关键词	Grain Boundary Triple Junction Cracking Copper Tricrystal Tetracrystal Stress-strain Curves Cyclic Deformation Polycrystalline Copper Bicrystals Metals
URL	查看原文
WOS记录号	WOS:000174881400004
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/36298
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	W. P. Jia,Z. Y. Zhu,Z. G. Wang,et al. Grain boundary triple junction effects on the fatigue deformation and cracking Behaviors of copper tricrystal and tetracrystals[J]. Journal of Materials Science & Technology,2002,18(2):108-112.
APA	W. P. Jia,Z. Y. Zhu,Z. G. Wang,&S. X. Li.(2002).Grain boundary triple junction effects on the fatigue deformation and cracking Behaviors of copper tricrystal and tetracrystals.Journal of Materials Science & Technology,18(2),108-112.
MLA	W. P. Jia,et al."Grain boundary triple junction effects on the fatigue deformation and cracking Behaviors of copper tricrystal and tetracrystals".Journal of Materials Science & Technology 18.2(2002):108-112.