Microstrain effect on thermal properties of nanocrystalline CU

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	Microstrain effect on thermal properties of nanocrystalline CU
	L. H. Qian; S. C. Wang; Y. H. Zhao; K. Lu
	2002
发表期刊	Acta Materialia
ISSN	1359-6454
卷号	50 期号:13 页码:3425-3434
摘要	The nanocrystalline (nc) Cu samples with different microstrains but the same grain size were obtained by annealing a magnetron-sputtered ne Cu specimen. Quantitative X-ray diffraction (XRD) measurements show that with an increment of the microstrain from 0.14 to 0.24% the thermal expansion coefficient (TEC) of crystalline lattice increases by about 12%, the static displacement of atom from the equilibrium position (B-S) increases from 0.47 +/- 0.09 to 1.16 +/- 0.15 Angstrom(2), and Debye characteristic temperature (Theta(D)) decreases from 307.1 +/- 3.1 to 279.2 +/- 2.8 K. The microstrain effect on thermal properties in the nc Cu might be attributed to the change in density of grain boundary defects/dislocations. The present investigation demonstrates that the thermal properties of ne materials are determined by not only the grain size but also the microstructure of grain boundaries. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
部门归属	chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;lu, k (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china
关键词	Magnetron Sputtering X-ray Diffraction (Xrd) Nanocrystalline Copper Thermal Properties X-ray-diffraction Gas Evaporation Technique Grain-growth Particles Palladium Copper Microstructure Temperature Boundaries Expansion
URL	查看原文
WOS记录号	WOS:000177559400011
引用统计	被引频次：89[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/36391
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	L. H. Qian,S. C. Wang,Y. H. Zhao,et al. Microstrain effect on thermal properties of nanocrystalline CU[J]. Acta Materialia,2002,50(13):3425-3434.
APA	L. H. Qian,S. C. Wang,Y. H. Zhao,&K. Lu.(2002).Microstrain effect on thermal properties of nanocrystalline CU.Acta Materialia,50(13),3425-3434.
MLA	L. H. Qian,et al."Microstrain effect on thermal properties of nanocrystalline CU".Acta Materialia 50.13(2002):3425-3434.