Adsorption behaviour of Schiff base and corrosion protection of resulting films to copper substrate | |
Z. L. Quan; S. H. Chen; L. Li; X. G. Cui | |
2002 | |
发表期刊 | Corrosion Science
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ISSN | 0010-938X |
卷号 | 44期号:4页码:703-715 |
摘要 | Self-assembled (SA) films of Schiff base were prepared on the copper surface. The corrosion protection abilities of SA films in chloride solution were evaluated using electrochemical impedance spectroscopy and polarization curves. A subsequent adsorption of 1-dodecanethiol on the original SA films of Schiff base improved significantly the protection ability to the copper substrate. The behavior of Schiff base adsorption on copper surface and subsequent adsorption of 1-dodecanethiol was probed by X-ray photoelectron spectroscopy. It was found that copper exists mainly in Cu(I) state in the SA films of Schiff base, and the thiol molecules subsequently adsorbed was bonded directly on copper surface rather than physisorbed on the previous SA films. (C) 2002 Elsevier Science Ltd. All rights reserved. |
部门归属 | shandong univ, dept chem, jinan 250100, peoples r china. state key lab corros & protect, shenyang 110016, peoples r china.;chen, sh (reprint author), shandong univ, dept chem, jinan 250100, peoples r china |
关键词 | Self-assembly Schiff Base Copper Corrosion Alkanethiol Self-assembled Monolayers Hydrochloric-acid Solution Gold Alkanethiols Impedance Surfaces Electrodissolution Dissolution Mechanisms Kinetics |
URL | 查看原文 |
WOS记录号 | WOS:000173629900005 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/36403 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | Z. L. Quan,S. H. Chen,L. Li,et al. Adsorption behaviour of Schiff base and corrosion protection of resulting films to copper substrate[J]. Corrosion Science,2002,44(4):703-715. |
APA | Z. L. Quan,S. H. Chen,L. Li,&X. G. Cui.(2002).Adsorption behaviour of Schiff base and corrosion protection of resulting films to copper substrate.Corrosion Science,44(4),703-715. |
MLA | Z. L. Quan,et al."Adsorption behaviour of Schiff base and corrosion protection of resulting films to copper substrate".Corrosion Science 44.4(2002):703-715. |
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