Modeling recrystallization of austenite for C-Mn steels during hot deformation by cellular automaton

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	Modeling recrystallization of austenite for C-Mn steels during hot deformation by cellular automaton
	L. Zhang; C. B. Zhang; X. H. Liu; G. D. Wang; Y. M. Wang
	2002
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	18 期号:2 页码:163-166
摘要	By using a cellular automaton method, microstructure evolution of recrystallization in austenite during hot deformation was simulated for C-Mn steels. A model takes into account the influence of deformation temperature, strain, and strain rate on the dynamic recrystallization fraction, and the effect of the keeping time on the static recrystallization fraction based on a hot deformation test on a Gleeble-1500 simulator. In addition, the size changing of gamma grains during continuous hot deformation was simulated by applying the model.
部门归属	northeastern univ, coll sci, shenyang 110006, peoples r china. northeastern univ, state key lab rolling & automat, shenyang 110006, peoples r china. chinese acad sci, inst met res, atom imaging solids lab, shenyang 110016, peoples r china.;zhang, l (reprint author), northeastern univ, coll sci, shenyang 110006, peoples r china
关键词	Cellular Automaton Recrystallization Grain Size Deformation Austenite Simulation
URL	查看原文
WOS记录号	WOS:000174881400019
引用统计	被引频次：10[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/36538
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	L. Zhang,C. B. Zhang,X. H. Liu,et al. Modeling recrystallization of austenite for C-Mn steels during hot deformation by cellular automaton[J]. Journal of Materials Science & Technology,2002,18(2):163-166.
APA	L. Zhang,C. B. Zhang,X. H. Liu,G. D. Wang,&Y. M. Wang.(2002).Modeling recrystallization of austenite for C-Mn steels during hot deformation by cellular automaton.Journal of Materials Science & Technology,18(2),163-166.
MLA	L. Zhang,et al."Modeling recrystallization of austenite for C-Mn steels during hot deformation by cellular automaton".Journal of Materials Science & Technology 18.2(2002):163-166.