Creep behavior of cold-rolled nanocrystalline pure copper

IMR OpenIR

	Creep behavior of cold-rolled nanocrystalline pure copper; Creep behavior of cold-rolled nanocrystalline pure copper
	B. Cai; Q. P. Kong; P. Cui; L. Lu; K. Lu
	2001 ; 2001
发表期刊	Scripta Materialia ; Scripta Materialia
ISSN	1359-6462 ; 1359-6462
卷号	45 期号:12 页码:1407-1413
摘要	The creep of cold rolled nanocrystalline Cu has been investigated at 20-50 degreesC. The most reasonable stress exponent is found to be 2, the corresponding activation energy is 0.82 eV. The results imply that the creep is possibly associated with grain boundary sliding. The increase of threshold stress after rolling is associated with the increase of microstrain. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.; The creep of cold rolled nanocrystalline Cu has been investigated at 20-50 degreesC. The most reasonable stress exponent is found to be 2, the corresponding activation energy is 0.82 eV. The results imply that the creep is possibly associated with grain boundary sliding. The increase of threshold stress after rolling is associated with the increase of microstrain. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
部门归属	acad sinica, inst solid state phys, internal frict & defects solids lab, hefei 230031, peoples r china. chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china.;kong, qp (reprint author), acad sinica, inst solid state phys, internal frict & defects solids lab, hefei 230031, peoples r china;qokong@mail.issp.ac.cn ; acad sinica, inst solid state phys, internal frict & defects solids lab, hefei 230031, peoples r china. chinese acad sci, met res inst, shenyang natl lab mat sci, shenyang 110016, peoples r china.;kong, qp (reprint author), acad sinica, inst solid state phys, internal frict & defects solids lab, hefei 230031, peoples r china;qokong@mail.issp.ac.cn
关键词	Creep Creep Nanocrystalline Copper Nanocrystalline Copper Cold Rolling Cold Rolling Grain Boundary Grain Boundary Diffusional Creep Diffusional Creep Temperature Creep Temperature Creep Grain-boundaries Grain-boundaries Room-temperature Room-temperature Superplasticity Superplasticity Deformation Deformation
URL	查看原文 ; 查看原文
WOS记录号	WOS:000173555500012 ; WOS:000173555500012
引用统计	被引频次：39[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/36600
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	B. Cai,Q. P. Kong,P. Cui,et al. Creep behavior of cold-rolled nanocrystalline pure copper, Creep behavior of cold-rolled nanocrystalline pure copper[J]. Scripta Materialia, Scripta Materialia,2001, 2001,45, 45(12):1407-1413, 1407-1413.
APA	B. Cai,Q. P. Kong,P. Cui,L. Lu,&K. Lu.(2001).Creep behavior of cold-rolled nanocrystalline pure copper.Scripta Materialia,45(12),1407-1413.
MLA	B. Cai,et al."Creep behavior of cold-rolled nanocrystalline pure copper".Scripta Materialia 45.12(2001):1407-1413.