IMR OpenIR
Diffusion of hydrogen along the grain boundaries in Ni3Al alloys
X. Y. Cheng; X. J. Wan; Q. Y. Wu; X. K. Sun
2001
发表期刊International Journal of Materials & Product Technology
ISSN0268-1900
页码841-846
摘要The diffusivity of hydrogen in two Nl(3)Al alloys has been measured in the temperature range 100degreesC to 420degreesC using an ultrahigh vacuum gaseous permeation technique. The diffusivity data fall into two segments, in which the hydrogen diffusivity adheres to the Arrhenius form, respectively. It is suggested that hydrogen transportation takes place along the grain boundaries at lower temperature and in the lattice at higher temperature. The intergranular fracture of L1(2)-type intermetallics induced by hydrogen at relatively low temperature results from hydrogen transportation along the grain boundaries, not in the lattice.
部门归属shanghai univ, inst mat res, shanghai 200072, peoples r china. chinese acad sci, inst met res, state key lab rsa, shenyang 110015, peoples r china.
关键词Hydrogen Diffusivity N1(3)A1 Alloys Ultrahigh Vacuum Gaseous Permeation Technique Environmental Embrittlement Nickel Transport
URL查看原文
WOS记录号WOS:000174604900067
引用统计
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/36616
专题中国科学院金属研究所
推荐引用方式
GB/T 7714
X. Y. Cheng,X. J. Wan,Q. Y. Wu,et al. Diffusion of hydrogen along the grain boundaries in Ni3Al alloys[J]. International Journal of Materials & Product Technology,2001:841-846.
APA X. Y. Cheng,X. J. Wan,Q. Y. Wu,&X. K. Sun.(2001).Diffusion of hydrogen along the grain boundaries in Ni3Al alloys.International Journal of Materials & Product Technology,841-846.
MLA X. Y. Cheng,et al."Diffusion of hydrogen along the grain boundaries in Ni3Al alloys".International Journal of Materials & Product Technology (2001):841-846.
条目包含的文件
条目无相关文件。
个性服务
推荐该条目
保存到收藏夹
查看访问统计
导出为Endnote文件
谷歌学术
谷歌学术中相似的文章
[X. Y. Cheng]的文章
[X. J. Wan]的文章
[Q. Y. Wu]的文章
百度学术
百度学术中相似的文章
[X. Y. Cheng]的文章
[X. J. Wan]的文章
[Q. Y. Wu]的文章
必应学术
必应学术中相似的文章
[X. Y. Cheng]的文章
[X. J. Wan]的文章
[Q. Y. Wu]的文章
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。