Heats of formation and phase stability for Cu-TM (TM=Ti, Zr, Hf) alloys with an analytic modified embedded atom model | |
W. Y. Hu; H. D. Xu; X. L. Shu; X. J. Yuan; B. W. Zhang | |
2001 | |
发表期刊 | International Journal of Materials & Product Technology
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ISSN | 0268-1900 |
页码 | 107-112 |
摘要 | The dilute-limit heats of solution, heats of formation of disorder solid solutions and intermetallic compounds, for Cu-TM (TM=Ti, Zr, Hf) alloys are calculated with an analytic modified embedded atom model. The calculated results are compared with the experimental data available and with the values predicted by Miedema's theory. The calculations of the heats of formation of Cu3TM and CuTM3 in the D0(22) and Ll(2) structure types, Cu2TM and CuTM2 in the Ga2Zr and Cll(b) structure type, CuTM in the Ll(0), B2, and B32 structure types indicate that the trends in structural stability can be interpreted directly in terms of the formation energy. |
部门归属 | hunan univ, dept appl phys, changsha 410082, peoples r china. chinese acad sci, int ctr mat phys, shenyang 110015, peoples r china. |
关键词 | Heats Of Formation Cu-tm (Tm=ti Phase Stability Zr Hf) Alloys Modified Embedded Atom Model Transition-metal Alloys Formation Enthalpies Binary-alloys Hcp Metals Fcc Energy |
URL | 查看原文 |
WOS记录号 | WOS:000174288300016 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/36673 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | W. Y. Hu,H. D. Xu,X. L. Shu,et al. Heats of formation and phase stability for Cu-TM (TM=Ti, Zr, Hf) alloys with an analytic modified embedded atom model[J]. International Journal of Materials & Product Technology,2001:107-112. |
APA | W. Y. Hu,H. D. Xu,X. L. Shu,X. J. Yuan,&B. W. Zhang.(2001).Heats of formation and phase stability for Cu-TM (TM=Ti, Zr, Hf) alloys with an analytic modified embedded atom model.International Journal of Materials & Product Technology,107-112. |
MLA | W. Y. Hu,et al."Heats of formation and phase stability for Cu-TM (TM=Ti, Zr, Hf) alloys with an analytic modified embedded atom model".International Journal of Materials & Product Technology (2001):107-112. |
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