Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates

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	Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates
	D. Jia; K. T. Ramesh; E. Ma; L. Lu; K. Lu
	2001
发表期刊	Scripta Materialia
ISSN	1359-6462
卷号	45 期号:5 页码:613-620
摘要	Uniaxial compression experiments for an electrodeposited nanostructured copper were performed at quasistatic strain rates of 4 x 10(-4) s(-1) and high strain rates of 3 x 10(3)-2 x 10(4) s(-1). The mechanical behavior of the no-Cu, including strength, strain hardening and strain-rate dependence of flow stress, is presented. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
部门归属	johns hopkins univ, dept mech engn, baltimore, md 21218 usa. johns hopkins univ, dept mat sci & engn, baltimore, md 21218 usa. acad sinica, inst met res, state key lab rsa, shenyang 110015, peoples r china.;ramesh, kt (reprint author), johns hopkins univ, dept mech engn, 122 latrobe hall,3400 n charles st, baltimore, md 21218 usa
关键词	Nc-copper Tem Grain Boundary Stress-strain Curve High Strain Rate Nanocrystalline Metals Temperature Deformation Cu
URL	查看原文
WOS记录号	WOS:000171307000017
引用统计	被引频次：63[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/36676
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	D. Jia,K. T. Ramesh,E. Ma,et al. Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates[J]. Scripta Materialia,2001,45(5):613-620.
APA	D. Jia,K. T. Ramesh,E. Ma,L. Lu,&K. Lu.(2001).Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates.Scripta Materialia,45(5),613-620.
MLA	D. Jia,et al."Compressive behavior of an electrodeposited nanostructured copper at quasistatic and high strain rates".Scripta Materialia 45.5(2001):613-620.