Relationship between tensile strength and preparation conditions for nickel foam

IMR OpenIR

	Relationship between tensile strength and preparation conditions for nickel foam
	P. S. Liu; K. M. Liang; S. W. Tu; S. R. Gu; Q. Yu; T. F. Li; C. Fu
	2001
发表期刊	Materials Science and Technology
ISSN	0267-0836
卷号	17 期号:9 页码:1069-1072
摘要	The relationship between preparation conditions and tensile strength has been investigated for a nickel foam produced by electrodeposition on an organic foam. After sintering in a NH3 decomposition atmosphere at 980 degreesC for 40 min, the results show that the tensile strength is hardly influenced by burning in air at 600 degreesC for 4 min beforehand, or by lowering the sintering temperature to 850 degreesC. During conductive treatment of the organic matrix it was found that coating with graphite base conductive colloid or chemically plating with Ni - P alloy (similar to 5 wt-%P) brought the same tensile strength for the eventual product.
部门归属	beijing normal univ, dept mat sci & engn, key lab beam technol & mat modificat, beijing 100875, peoples r china. tsing hua univ, dept mat sci & engn, beijing 100084, peoples r china. state key lab corros & protect met, shenyang 110015, peoples r china.;liu, ps (reprint author), beijing normal univ, dept mat sci & engn, key lab beam technol & mat modificat, beijing 100875, peoples r china
关键词	High-porosity Metals
URL	查看原文
WOS记录号	WOS:000171337400007
引用统计	被引频次：11[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/36719
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	P. S. Liu,K. M. Liang,S. W. Tu,et al. Relationship between tensile strength and preparation conditions for nickel foam[J]. Materials Science and Technology,2001,17(9):1069-1072.
APA	P. S. Liu.,K. M. Liang.,S. W. Tu.,S. R. Gu.,Q. Yu.,...&C. Fu.(2001).Relationship between tensile strength and preparation conditions for nickel foam.Materials Science and Technology,17(9),1069-1072.
MLA	P. S. Liu,et al."Relationship between tensile strength and preparation conditions for nickel foam".Materials Science and Technology 17.9(2001):1069-1072.