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Computer simulation of reactive sputtering
S. L. Zhu; F. H. Wang; W. T. Wu; L. Xin; C. S. Hu; S. L. Yang; S. J. Geng; M. S. Li; Y. M. Xiong; K. W. Chen
2001
发表期刊International Journal of Materials & Product Technology
ISSN0268-1900
页码101-106
摘要Computer simulations of direct current reactive sputtering based on a kinetics model were carried out in this article. It was revealed that, reactive sputtering exhibited steady state transition-free and hysteresis-free behavior, only when the sputtering yield of compound was approximately that of the corresponding metal. By changing the configuration of the sputter system (discharge current, target area, pumping rate), it was possible to get a hysteresis-free reactive sputtering behavior. However, it was too difficult to eliminate the steady states transition by this method. The much lower value of the sputtering yield, as compared with that of the corresponding metal, might be the most important cause of the steady state transition and hysteresis effect.
部门归属chinese acad sci, inst met res, state key lab corros & protect, shenyang 110015, peoples r china. fushun petr inst, fushun 113001, peoples r china.
关键词Reactive Sputtering Computer Simulation Kinetics Modeling Films Deposition
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WOS记录号WOS:000174288300015
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被引频次:5[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/36966
专题中国科学院金属研究所
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GB/T 7714
S. L. Zhu,F. H. Wang,W. T. Wu,et al. Computer simulation of reactive sputtering[J]. International Journal of Materials & Product Technology,2001:101-106.
APA S. L. Zhu.,F. H. Wang.,W. T. Wu.,L. Xin.,C. S. Hu.,...&K. W. Chen.(2001).Computer simulation of reactive sputtering.International Journal of Materials & Product Technology,101-106.
MLA S. L. Zhu,et al."Computer simulation of reactive sputtering".International Journal of Materials & Product Technology (2001):101-106.
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