Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples

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	Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples
	L. Lu; L. B. Wang; B. Z. Ding; K. Lu
	2000
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093
卷号	286 期号:1 页码:125-129
摘要	The objective of this work is to investigate the microstrain effect on grain growth and strain release processes in nanocrystalline (nc) samples. Two kinds of nc Cu samples were studied by using differential scanning calorimetry (DSC), X-ray diffraction (XRD) and transmission electron microscopy (TEM): an electro-deposited nc Cu sample with an average grain size of about 30 nm and one after cold-rolling in which the average grain size remain unchanged but the microstrain is substantially elevated. Measurement results indicated for the electro-deposited nc Cu, grain growth occurs at about 70 degrees C, which was prior to the major strain release process (onset at 150 degrees C). While for the as-rolled nc Cu, the grain growth onset temperature increases up to about 150 degrees C and that of the strain release process drops to about 115 degrees C. These results showed an evident correlation between the grain size stability and the microstrain in the nc materials. (C) 2000 Elsevier Science S.A. All rights reserved.
部门归属	chinese acad sci, state key lab rsa, inst met res, shenyang 110015, peoples r china.;lu, k (reprint author), chinese acad sci, state key lab rsa, inst met res, shenyang 110015, peoples r china
关键词	Nanocrystalline Cu Grain Growth Strain Release Microstrain Grain-growth Metals Alloys
URL	查看原文
WOS记录号	WOS:000088914700021
引用统计	被引频次：43[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/37119
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	L. Lu,L. B. Wang,B. Z. Ding,et al. Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2000,286(1):125-129.
APA	L. Lu,L. B. Wang,B. Z. Ding,&K. Lu.(2000).Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,286(1),125-129.
MLA	L. Lu,et al."Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 286.1(2000):125-129.