High-tensile ductility in nanocrystalline copper

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	High-tensile ductility in nanocrystalline copper
	L. Lu; L. B. Wang; B. Z. Ding; K. Lu
	2000
发表期刊	Journal of Materials Research
ISSN	0884-2914
卷号	15 期号:2 页码:270-273
摘要	In this work we report a high-tensile ductility in a fully dense bulk nanocrystalline (nc) pure copper sample prepared by electrodeposition. A tensile ductility with an elongation to fracture of 30% was obtained in the ne Cu specimen with an average grain size of 27 nm, which is comparable to that for the coarse-grained polycrystalline Cu. An enhanced yield stress (119 MPa) and a depressed strain hardening exponent (0.22) were observed in the nc Cu sample with respect to the conventional polycrystalline Cu. The high-tensile ductility was attributed to the minimized artifacts in the nc sample, and the grain-boundary sliding deformation mechanism resulted from the numerous amount small-angle grain boundaries and the low microstrain (dislocation density).
部门归属	chinese acad sci, inst met res, state key lab rsa, shenyang 110015, peoples r china.;lu, k (reprint author), chinese acad sci, inst met res, state key lab rsa, shenyang 110015, peoples r china;kelu@imr.ac.cn
关键词	Behavior Cu Pd
URL	查看原文
WOS记录号	WOS:000085235300002
引用统计	被引频次：122[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/37120
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	L. Lu,L. B. Wang,B. Z. Ding,et al. High-tensile ductility in nanocrystalline copper[J]. Journal of Materials Research,2000,15(2):270-273.
APA	L. Lu,L. B. Wang,B. Z. Ding,&K. Lu.(2000).High-tensile ductility in nanocrystalline copper.Journal of Materials Research,15(2),270-273.
MLA	L. Lu,et al."High-tensile ductility in nanocrystalline copper".Journal of Materials Research 15.2(2000):270-273.