Interface controlled diffusional creep of nanocrystalline pure copper

IMR OpenIR

	Interface controlled diffusional creep of nanocrystalline pure copper
	B. Cai; Q. P. Kong; L. Lu; K. Lu
	1999
发表期刊	Scripta Materialia
ISSN	1359-6462
卷号	41 期号:7 页码:755-759
部门归属	chinese acad sci, inst solid state phys, internal frict & defects solids lab, hefei 230031, peoples r china. chinese acad sci, inst met res, state key lab rsa, shenyang 110015, peoples r china.;cai, b (reprint author), chinese acad sci, inst solid state phys, internal frict & defects solids lab, hefei 230031, peoples r china
关键词	Nanocrystalline Materials Copper Creep Grain Boundary Diffusion Ni-p Alloy Temperature Creep Metals Dependence Behavior Stress
URL	查看原文
WOS记录号	WOS:000082481300013
引用统计	被引频次：92[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/37308
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	B. Cai,Q. P. Kong,L. Lu,et al. Interface controlled diffusional creep of nanocrystalline pure copper[J]. Scripta Materialia,1999,41(7):755-759.
APA	B. Cai,Q. P. Kong,L. Lu,&K. Lu.(1999).Interface controlled diffusional creep of nanocrystalline pure copper.Scripta Materialia,41(7),755-759.
MLA	B. Cai,et al."Interface controlled diffusional creep of nanocrystalline pure copper".Scripta Materialia 41.7(1999):755-759.