Fabrication and properties of Bi-2223 Ag-Au-Al alloy-sheathed tapes prepared by a controlled melting process | |
L. Hua; J. M. Yoo; J. W. Ko; H. D. Kim; H. S. Chung; G. W. Qiao | |
1999 | |
发表期刊 | Superconductor Science & Technology
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ISSN | 0953-2048 |
卷号 | 12期号:3页码:153-157 |
摘要 | Bi-2223 Ag-Au-Al alloy-sheathed tapes with J(ct) (77 K, 0 T) up to similar to 20 kA cm(-2) were fabricated by a controlled melting (CM) process. It was found that the CM process is effective for eliminating weak links and improving the transport properties of Bi-2223 Ag-Au-Al alloy-sheathed tapes. The Bi-2223 phase decomposition is accelerated with the increase of melting temperature. Too high melting temperature may cause severe phase segregation, which is unrecoverable in the subsequent heat treatments. The effect of slow cooling rate on the transport properties is not obvious because of the low thermal conductivity of the Ag alloy sheath. |
部门归属 | korea inst machinery & mat, changwon 641010, south korea. chinese acad sci, inst met res, shenyang 110015, peoples r china.;hua, l (reprint author), korea inst machinery & mat, 66 sangnam dong, changwon 641010, south korea |
关键词 | Critical-current-density Superconducting Tapes Cu-o Microstructure Phase Irreversibility Temperature Mechanism Behavior Wires |
URL | 查看原文 |
WOS记录号 | WOS:000079212900008 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/37372 |
专题 | 中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | L. Hua,J. M. Yoo,J. W. Ko,et al. Fabrication and properties of Bi-2223 Ag-Au-Al alloy-sheathed tapes prepared by a controlled melting process[J]. Superconductor Science & Technology,1999,12(3):153-157. |
APA | L. Hua,J. M. Yoo,J. W. Ko,H. D. Kim,H. S. Chung,&G. W. Qiao.(1999).Fabrication and properties of Bi-2223 Ag-Au-Al alloy-sheathed tapes prepared by a controlled melting process.Superconductor Science & Technology,12(3),153-157. |
MLA | L. Hua,et al."Fabrication and properties of Bi-2223 Ag-Au-Al alloy-sheathed tapes prepared by a controlled melting process".Superconductor Science & Technology 12.3(1999):153-157. |
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