Microstructure and in-plane resistivity of Cu/Ni multilayers

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	Microstructure and in-plane resistivity of Cu/Ni multilayers
	W. Wang; R. F. Huang; L. S. Wen; L. P. Guo; W. K. Wang
	1999
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	15 期号:1 页码:75-78
摘要	The Cu/Ni multilayers were deposited using ion beam sputtering at room temperature and 250 degrees C respectively. The microstructures of the multilayers including interfacial roughness, grain size and growth direction have been investigated by transmission electron microscopy and X-ray diffraction. The microstructure depends strongly on the substrate temperature and modulation wavelength, bigger grain size and larger interfacial roughness were obtained when the multilayers were deposited at 250 degrees C, and the multilayers ceased to grow epitaxially due to the increasing defects in the multilayers. The resistivity of the multilayers is very sensitive to the microstructure due to the size-effect. In order to study the influence of the microstructure to the resistivity, the in-plane resistivity of Cu/Ni multilayers was measured using four-point probe. The resistivity increases with higher substrate temperature, and it decreases when the modulation wavelength becomes short. The interfacial roughness and grain size have co-contribution to the resistivity. The interface scattering is the main factor that has effect on the resistivity of Cu/Ni multilayers.
部门归属	chinese acad sci, inst met res, shenyang 110015, peoples r china. chinese acad sci, inst phys, beijing 100080, peoples r china.;wang, w (reprint author), chinese acad sci, inst met res, shenyang 110015, peoples r china
关键词	Thin-films Electrical-resistivity Superlattices Microscopy Surface Ni
URL	查看原文
WOS记录号	WOS:000078112600018
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/37523
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	W. Wang,R. F. Huang,L. S. Wen,et al. Microstructure and in-plane resistivity of Cu/Ni multilayers[J]. Journal of Materials Science & Technology,1999,15(1):75-78.
APA	W. Wang,R. F. Huang,L. S. Wen,L. P. Guo,&W. K. Wang.(1999).Microstructure and in-plane resistivity of Cu/Ni multilayers.Journal of Materials Science & Technology,15(1),75-78.
MLA	W. Wang,et al."Microstructure and in-plane resistivity of Cu/Ni multilayers".Journal of Materials Science & Technology 15.1(1999):75-78.