Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction

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	Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction
	W. P. Jia; S. X. Li; Z. G. Wang; G. Y. Li
	1998
发表期刊	Journal of Materials Science Letters
ISSN	0261-8028
卷号	17 期号:12 页码:1041-1044
部门归属	acad sinica, inst met res, state key lab fatigue & fracture mat, shenyang 110015, peoples r china.;jia, wp (reprint author), acad sinica, inst met res, state key lab fatigue & fracture mat, shenyang 110015, peoples r china
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WOS记录号	WOS:000078836600019
引用统计	被引频次：9[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/37685
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	W. P. Jia,S. X. Li,Z. G. Wang,et al. Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction[J]. Journal of Materials Science Letters,1998,17(12):1041-1044.
APA	W. P. Jia,S. X. Li,Z. G. Wang,&G. Y. Li.(1998).Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction.Journal of Materials Science Letters,17(12),1041-1044.
MLA	W. P. Jia,et al."Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction".Journal of Materials Science Letters 17.12(1998):1041-1044.