| Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction | |
| W. P. Jia; S. X. Li; Z. G. Wang; G. Y. Li | |
| 1998 | |
| Source Publication | Journal of Materials Science Letters
 |
| ISSN | 0261-8028 |
| Volume | 17Issue:12Pages:1041-1044 |
| description.department | acad sinica, inst met res, state key lab fatigue & fracture mat, shenyang 110015, peoples r china.;jia, wp (reprint author), acad sinica, inst met res, state key lab fatigue & fracture mat, shenyang 110015, peoples r china |
| URL | 查看原文 |
| WOS ID | WOS:000078836600019 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/37685 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | W. P. Jia,S. X. Li,Z. G. Wang,et al. Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction[J]. Journal of Materials Science Letters,1998,17(12):1041-1044. |
| APA | W. P. Jia,S. X. Li,Z. G. Wang,&G. Y. Li.(1998).Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction.Journal of Materials Science Letters,17(12),1041-1044. |
| MLA | W. P. Jia,et al."Fatigue behaviors of a copper tricrystal - Part II - Crystallographic fatigue crack growth in the vicinity of the triple junction".Journal of Materials Science Letters 17.12(1998):1041-1044. |
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