Tunable Reactive Wetting of Sn on Microporous Cu Layer

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	Tunable Reactive Wetting of Sn on Microporous Cu Layer
	Q. Q. Lai; L. Zhang; C. Chen; J. K. Shang
	2012
发表期刊	Journal of Materials Science & Technology
ISSN	1005-0302
卷号	28 期号:4 页码:379-384
摘要	Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interfacial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process.
部门归属	[lai, qingquan; zhang, lei; chen, cai; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhang, l (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;lzhang@imr.ac.cn
关键词	Wetting Porous Material Soldering Copper Substrate Porous Copper Infiltration Kinetics Carbide Silicon
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/60041
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. Q. Lai,L. Zhang,C. Chen,et al. Tunable Reactive Wetting of Sn on Microporous Cu Layer[J]. Journal of Materials Science & Technology,2012,28(4):379-384.
APA	Q. Q. Lai,L. Zhang,C. Chen,&J. K. Shang.(2012).Tunable Reactive Wetting of Sn on Microporous Cu Layer.Journal of Materials Science & Technology,28(4),379-384.
MLA	Q. Q. Lai,et al."Tunable Reactive Wetting of Sn on Microporous Cu Layer".Journal of Materials Science & Technology 28.4(2012):379-384.