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Grain refinement of Al-Cu alloy in low voltage pulsed magnetic field
Y. J. Li; W. Z. Tao; Y. S. Yang
2012
Source PublicationJournal of Materials Processing Technology
ISSN0924-0136
Volume212Issue:4Pages:903-909
AbstractThe effect of a low voltage pulsed magnetic field (LVPMF) on grain refinement of Al-Cu alloy was investigated at different solidification stages. The cooling curve was also studied to investigate the grain refinement mechanism of LVPMF. The fine grains are obtained by applying the LVPMF during the nucleation stage. The LVPMF has no obvious influence on the solidification structure when it is applied during liquid phase stage or crystal growth stage. Application of LVPMF increases the nucleation temperature of the isomorphous transformation, and also decreases the recalescence magnitude of the alloy. The refining mechanism was proposed that the LVPMF provides extra energy for nucleation, which decreases the energy barrier and the critical radius for nucleation, leading to high nucleation rate and grain refinement. (C) 2011 Elsevier B.V. All rights reserved.
description.department[li, y. j.; tao, w. z.; yang, y. s.] chinese acad sci, inst met res, shenyang 110016, peoples r china.;yang, ys (reprint author), chinese acad sci, inst met res, shenyang 110016, peoples r china.;ysyang@imr.ac.cn
KeywordGrain Refinement Low Voltage Pulsed Magnetic Field Solidification Structure Al-cu Alloy Stainless-steel Solidification Microstructure Transformation
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/60082
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Y. J. Li,W. Z. Tao,Y. S. Yang. Grain refinement of Al-Cu alloy in low voltage pulsed magnetic field[J]. Journal of Materials Processing Technology,2012,212(4):903-909.
APA Y. J. Li,W. Z. Tao,&Y. S. Yang.(2012).Grain refinement of Al-Cu alloy in low voltage pulsed magnetic field.Journal of Materials Processing Technology,212(4),903-909.
MLA Y. J. Li,et al."Grain refinement of Al-Cu alloy in low voltage pulsed magnetic field".Journal of Materials Processing Technology 212.4(2012):903-909.
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