Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating

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	Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating
	J. Shi; A. Kumar; L. Zhang; X. Jiang; Z. L. Pei; J. Gong; C. Sun
	2012
发表期刊	Surface & Coatings Technology
ISSN	0257-8972
卷号	206 期号:11-12 页码:2947-2953
摘要	In this paper, detailed properties of Ti-Al-Si-N nanocomposite films doped with Cu additive at various concentrations are studied and followed with careful discussion. Deposited on high speed steel substrates with the assistance of vacuum cathode arc ion plating, the film composition and crystallinity can be controlled by changing the target composition. Then the film structure, chemical and phase composition, mechanical and tribological properties are characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), field emission scanning electron microscope (FESEM) and high resolution transmission electron microscopy (HRTEM), atomic force microscopy (AFM), nanoindentation and Rockwell indenter. The results indicate that with increasing copper content in the film systems, a reduction of the grain size and a deterioration of the preferred orientation were detected by XRD and HRTEM. Furthermore the film hardness H and the elastic modulus E decrease from 35 +/- 6 to 13 +/- 1 GPa and from 286 +/- 26 to 163 +/- 13 GPa, respectively. The ratio H-3/E-2 is calculated on basis of measurements of hardness H and Young's modulus E. The adhesive strength between the film and the substrate is strongly improved, compared to others without Cu additive, as well as the tribological performance of the films. This whole study implies that these Cu-doped nanocomposite films deserve some cautiousness before its application for wear resistance. (C) 2011 Elsevier B.V. All rights reserved.
部门归属	[shi, j.; jiang, x.; pei, z. l.; gong, j.; sun, c.] chinese acad sci, inst met res, shenyang 110016, peoples r china. [shi, j.; kumar, a.; zhang, l.; jiang, x.] univ siegen, inst mat engn, d-57076 siegen, germany.;jiang, x (reprint author), univ siegen, x jiang inst mat engn, paul bonatz str 9-11, d-57076 siegen, germany.;xin.jiang@uni-siegen.de; csun@imr.ac.cn
关键词	Cathode Arc Ion Plating Ti-al-si-n Nanocomposite Films Nanoindentation Adhesive Strength Mechanical-properties Surface Oxidation Titanium Nitride Coatings Hardness Microstructure Silicon Gpa Xps
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/60222
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	J. Shi,A. Kumar,L. Zhang,et al. Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating[J]. Surface & Coatings Technology,2012,206(11-12):2947-2953.
APA	J. Shi.,A. Kumar.,L. Zhang.,X. Jiang.,Z. L. Pei.,...&C. Sun.(2012).Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating.Surface & Coatings Technology,206(11-12),2947-2953.
MLA	J. Shi,et al."Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating".Surface & Coatings Technology 206.11-12(2012):2947-2953.