| In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM | |
| M. N. Wang; J. Q. Wang; H. Feng; W. Ke | |
| 2012 | |
| Source Publication | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
 |
| ISSN | 0921-5093 |
| Volume | 558Pages:649-655 |
| Abstract | The effect of microstructure and corrosion on fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy was in-situ studied at three-point bending test using environmental scanning electron microscopy (ESEM). The results showed that the microcracks initiated at the Sn boundaries in the beta-Sn region for commercial SAC305 solder. For furnace-cooled SAC305 solder, cracks preferred to initiating and propagating along Sn boundaries and Sn/Ag3Sn interface. Ag3Sn plates were easily broken during the bending test. The fracture behavior was significantly affected by corrosion. The most vulnerable area to fracture is the corroded region of the specimen. (C) 2012 Elsevier B.V. All rights reserved. |
| description.department | [wang, mingna; wang, jianqiu; ke, wei] chinese acad sci, inst met res, state key lab corros & protect, shenyang 110016, peoples r china. [feng, hao] china natl elect apparat res inst, state key lab environm adaptabil ind prod, guangzhou 510300, guangdong, peoples r china.;wang, jq (reprint author), chinese acad sci, inst met res, state key lab corros & protect, 62 wencui rd, shenyang 110016, peoples r china.;wangjianqiu@imr.ac.cn |
| Keyword | Lead-free Solder Microstructure Corrosion Three-point Bending Fracture Electrochemical Corrosion Behavior 3.5-percent Nacl Solution Ga Solder Alloys Sn Joints |
| URL | 查看原文 |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/60297 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | M. N. Wang,J. Q. Wang,H. Feng,et al. In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2012,558:649-655. |
| APA | M. N. Wang,J. Q. Wang,H. Feng,&W. Ke.(2012).In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,558,649-655. |
| MLA | M. N. Wang,et al."In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 558(2012):649-655. |
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