Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

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	Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
	M. N. Wang; J. Q. Wang; H. Feng; W. Ke
	2012
发表期刊	Corrosion Science
ISSN	0010-938X
卷号	63 页码:20-28
摘要	The aim of this study is to evaluate the effects of Ag3Sn intermetallic compounds (IMCs) on corrosion of Sn-3.0Ag-0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. The Ag3Sn IMCs of SAC305 with various size and morphology were obtained by changing cooling rate. Commercial SAC305 solder with smallest Ag3Sn IMCs exhibits better corrosion resistance than air-cooled and furnace-cooled SAC305 solders because microgalvanic corrosion between large cathodic Ag3Sn IMCs plates and anodic Sn matrix decreased the corrosion resistance of air-cooled and furnace-cooled SAC305 solders. (c) 2012 Elsevier Ltd. All rights reserved.
部门归属	[wang, mingna; wang, jianqiu; ke, wei] chinese acad sci, inst met res, state key lab corros & protect, shenyang 110016, peoples r china. [feng, hao] china natl elect apparat res inst, state key lab environm adaptabil ind prod, guangzhou 510300, guangdong, peoples r china.;wang, jq (reprint author), chinese acad sci, inst met res, state key lab corros & protect, 62 wencui rd, shenyang 110016, peoples r china.;wangjianqiu@imr.ac.cn
关键词	Electronic Materials Alloy Sem Xps Atmospheric Corrosion Lead-free Solders Ag-cu Alloys Electrochemical Corrosion Nacl Solution Tin Behavior Microstructure Surface
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/60298
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	M. N. Wang,J. Q. Wang,H. Feng,et al. Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition[J]. Corrosion Science,2012,63:20-28.
APA	M. N. Wang,J. Q. Wang,H. Feng,&W. Ke.(2012).Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition.Corrosion Science,63,20-28.
MLA	M. N. Wang,et al."Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition".Corrosion Science 63(2012):20-28.