Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder

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	Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder
	M. N. Wang; J. Q. Wang; H. Feng; W. Ke
	2012
发表期刊	Journal of Materials Science-Materials in Electronics
ISSN	0957-4522
卷号	23 期号:1 页码:148-155
摘要	The heterogeneous microstructure of solder could be obtained when cooling rate of the solder joint was not even, which would affect the corrosion behavior of solder during service. The ambient temperature would also affect the corrosion behavior of solder joint. In this paper, the effects of microstructure and temperature on the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder were investigated. The various microstructures of SAC305 lead-free solder were obtained by cooling specimens in air and furnace. Compared to the fine-fibrous Ag(3)Sn phase inside the commercial SAC305 solder, platelet-like Ag(3)Sn formed as cooling speed decreasing. The polarization behavior of SAC305 solders in 3.5 wt.% NaCl solution was not significantly affected by various microstructures, but sensitive to temperature.
部门归属	[wang, mingna; wang, jianqiu; ke, wei] chinese acad sci, inst met res, state key lab corros & protect, shenyang 110016, peoples r china. [feng, hao] china natl elect apparat res inst, state key lab environm adaptabil ind prod, guangzhou 510300, guangdong, peoples r china.;wang, jq (reprint author), chinese acad sci, inst met res, state key lab corros & protect, 62 wencui rd, shenyang 110016, peoples r china.;wangjianqiu@imr.ac.cn
关键词	Ag-cu Alloys Electrochemical Corrosion Buffer Solutions Nacl Solution Tin Snagcu Joints
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/60299
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	M. N. Wang,J. Q. Wang,H. Feng,et al. Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder[J]. Journal of Materials Science-Materials in Electronics,2012,23(1):148-155.
APA	M. N. Wang,J. Q. Wang,H. Feng,&W. Ke.(2012).Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder.Journal of Materials Science-Materials in Electronics,23(1),148-155.
MLA	M. N. Wang,et al."Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder".Journal of Materials Science-Materials in Electronics 23.1(2012):148-155.