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Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints
L. M. Yang; Q. K. Zhang; Z. F. Zhang
2012
发表期刊Scripta Materialia
ISSN1359-6462
卷号67期号:7-8页码:637-640
摘要Shear fracture behaviors of Cu/Sn-3Cu/Cu joints with different solder dimensions were investigated. The experimental results demonstrate that, with decreasing ratio R of the solder thickness to length, the interfacial shear strength increased and the fracture mode changed from ductile to a mixture of ductile and brittle. Based on the interfacial stress analysis across the solder joint, a hyperbolic formula expressing the relationship between the interfacial shear strength and the ratio R was proposed. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
部门归属[yang, l. m.; zhang, q. k.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [yang, l. m.] univ sci & technol china, hefei 230026, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china.;zhfzhang@imr.ac.cn
关键词Solder Joint Interfaces Intermetallic Compounds Fracture Shear Strength Lead-free Solder Brazed Joints Size Sn Microstructure Deformation Reliability Failure Copper Cu
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文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/60394
专题中国科学院金属研究所
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L. M. Yang,Q. K. Zhang,Z. F. Zhang. Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints[J]. Scripta Materialia,2012,67(7-8):637-640.
APA L. M. Yang,Q. K. Zhang,&Z. F. Zhang.(2012).Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints.Scripta Materialia,67(7-8),637-640.
MLA L. M. Yang,et al."Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints".Scripta Materialia 67.7-8(2012):637-640.
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