Correlation between wear resistance and subsurface recrystallization structure in copper

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	Correlation between wear resistance and subsurface recrystallization structure in copper
	B. Yao; Z. Han; K. Lu
	2012
Source Publication	Wear
ISSN	0043-1648
Volume	294 Pages:438-445
Abstract	Wear of conventional metallic materials involves various complex solid state processes of which the dominant process is elusive. From a thorough experimental investigation on the worn subsurface structure evolution in pure copper specimens with various microstructures, we conclude that the transformation from the subsurface dynamic recrystallization (DRX) structure into the top nanostructured mixing layer (NML) is the most important process which could determine the wear rate. A pronounced correlation is identified that wear rate increases significantly with an increasing grain size or a decreasing hardness of the DRX structure adjacent to the NML This result points out an effective approach to make materials better against wear by stabilizing the deformed structure against DRX. (C) 2012 Elsevier B.V. All rights reserved.
description.department	[yao, b.; han, z.; lu, k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;han, z (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china.;zhonghan@imr.ac.cn
Keyword	Sliding Wear Hardness Non-ferrous Metals Electron Microscopy Dynamic Plastic-deformation Thermal-stability Microstructural Evolution Metals Alloys Cu Microhardness Friction Behavior Hardness
URL	查看原文
Document Type	期刊论文
Identifier	http://ir.imr.ac.cn/handle/321006/60410
Collection	中国科学院金属研究所
Recommended Citation GB/T 7714	B. Yao,Z. Han,K. Lu. Correlation between wear resistance and subsurface recrystallization structure in copper[J]. Wear,2012,294:438-445.
APA	B. Yao,Z. Han,&K. Lu.(2012).Correlation between wear resistance and subsurface recrystallization structure in copper.Wear,294,438-445.
MLA	B. Yao,et al."Correlation between wear resistance and subsurface recrystallization structure in copper".Wear 294(2012):438-445.

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