| Impurity Effect on Wear Resistance of Ultrafine-Grained Copper |
| B. Yao; Z. Han; K. Lu
|
| 2012
|
| 发表期刊 | Journal of Materials Science & Technology
 |
| ISSN | 1005-0302
|
| 卷号 | 28期号:6页码:481-487 |
| 摘要 | The wear properties of ultrafine-grained (UFG) Cu samples of different purities were investigated in comparison with the coarse-grained (CG) Cu. The UFG Cu samples, prepared by means of plastic deformation via quasi-static compression, exhibit an enhanced wear resistance relative to the CG Cu samples. For both the UFG and the CG Cu samples, wear volumes increase at higher purities. A steady state worn subsurface structure was formed in each sample after sliding for 60 min, consisting of a heavily deformed nanostructured mixing layer (NML) on top of a continuous dynamic recrystallization (DRX) layer. A pronounced correlation is identified that wear volume increases monotonically with an increasing grain size of the DRX layer. The impurity level of the Cu samples has an obvious influence on the DRX grain sizes, which in turn determines the wear resistance of the Cu samples. |
| 部门归属 | [yao, bin; han, zhong; lu, ke] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;han, z (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china.;zhong-han@imr.ac.cn
|
| 关键词 | Ultrafine Grained Copper
Wear Resistance
Impurity
Subsurface
Microstructure
Dynamic Recrystallization
Dynamic Plastic-deformation
Friction
Growth
Behavior
Steel
Size
Al
Aluminum
Surface
Metals
|
| URL | 查看原文
|
| 文献类型 | 期刊论文
|
| 条目标识符 | http://ir.imr.ac.cn/handle/321006/60411
|
| 专题 | 中国科学院金属研究所
|
推荐引用方式
GB/T 7714 |
B. Yao,Z. Han,K. Lu. Impurity Effect on Wear Resistance of Ultrafine-Grained Copper[J]. Journal of Materials Science & Technology,2012,28(6):481-487.
|
| APA |
B. Yao,Z. Han,&K. Lu.(2012).Impurity Effect on Wear Resistance of Ultrafine-Grained Copper.Journal of Materials Science & Technology,28(6),481-487.
|
| MLA |
B. Yao,et al."Impurity Effect on Wear Resistance of Ultrafine-Grained Copper".Journal of Materials Science & Technology 28.6(2012):481-487.
|
修改评论