In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction

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	In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction
	Q. K. Zhang; Z. F. Zhang
	2012
Source Publication	Scripta Materialia
ISSN	1359-6462
Volume	67 Issue:3 Pages:289-292
Abstract	In this study, the in situ tensile creep behaviors of Sn-4Ag/Cu solder joints were observed, and microstructural evolutions of the solder during the deformation processes were characterized by electron backscatter diffraction. The results reveal that slow plastic deformation or grain rotation occurs inside different solder grains, depending on their orientations and distance from the joint interface. When the strain increases to a certain extent, dynamic recovery occurs inside some solder grains, resulting in polygonization and grain subdivision. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
description.department	[zhang, q. k.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhfzhang@imr.ac.cn
Keyword	Sn-4ag Solder In Situ Tensile Creep Electron Backscatter Diffraction (Ebsd) Polygonization Grains Subdivision Sn-ag Stress-relaxation Fracture-behavior Thermal Fatigue Deformation Grain Recrystallization Microstructure Orientation Evolution
URL	查看原文
Document Type	期刊论文
Identifier	http://ir.imr.ac.cn/handle/321006/60455
Collection	中国科学院金属研究所
Recommended Citation GB/T 7714	Q. K. Zhang,Z. F. Zhang. In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction[J]. Scripta Materialia,2012,67(3):289-292.
APA	Q. K. Zhang,&Z. F. Zhang.(2012).In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction.Scripta Materialia,67(3),289-292.
MLA	Q. K. Zhang,et al."In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction".Scripta Materialia 67.3(2012):289-292.

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