Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys

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	Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys
	H. F. Zhou; J. D. Guo; J. K. Shang
	2012
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	41 期号:11 页码:3161-3168
摘要	Interfacial reactions between liquid Sn and electroless xFeNiP alloys (where x is the at.% of Fe) were investigated to determine the suitability of electroless Fe-Ni films as a potential under-bump metallization in solder interconnections. It was found that the interfacial reactions depended strongly on the Fe percentage in the electroless Fe-Ni alloys. The FeSn2 compound layer was observed at the interface of alloys with high atomic percentage of Fe, such as 55 at.% and 75 at.%, while both FeSn2 and Ni3Sn4 layers were found at the interface at low Fe concentration such as 25 at.%. The growth rate of interfacial intermetallic compounds and the amount of intermetallic whiskers grown on the FeNiP coatings decreased with increasing Fe percentage. The presence of FeSn2 phase in Fe-Ni alloys at different Fe concentrations was believed to result from the lower Gibbs free energy for FeSn2 formation in the Sn/FeNiP system, while the variation in the growth rate of the intermetallic layer with Fe concentration was related to the different growth rates of FeSn2 and Ni3Sn4 compounds.
部门归属	[zhou, haifei; guo, jingdong; shang, jian ku] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, jian ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;zhou, hf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;jdguo@imr.ac.cn; jkshang@imr.ac.cn
关键词	Electroless Fe-ni Under-bump Metallization Interfacial Reaction Lead-free Solders Wetting Balance Snagcu Solder Cu Joints Solderability Growth Ag
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/60525
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zhou,J. D. Guo,J. K. Shang. Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys[J]. Journal of Electronic Materials,2012,41(11):3161-3168.
APA	H. F. Zhou,J. D. Guo,&J. K. Shang.(2012).Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys.Journal of Electronic Materials,41(11),3161-3168.
MLA	H. F. Zhou,et al."Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys".Journal of Electronic Materials 41.11(2012):3161-3168.