Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading

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	Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading
	Q. S. Zhu; H. Y. Liu; Z. G. Wang; J. K. Shang
	2012
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	41 期号:4 页码:741-747
摘要	Morphological changes from electromigration were examined on microsized Sn-Ag-Cu, pure Sn, and single-crystal Sn solder interconnects. It was found that both grain structure and alloying had a strong influence on the form of electromigration damage. In polycrystal Sn, grain boundary grooves were the primary form of electromigration damage, while in single-crystal Sn interconnects wavy surface relief appeared following electromigration. Alloying with Ag and Cu encouraged formation of Sn hillocks and Cu6Sn5 intermetallic compound (IMC) segregation. The grain boundary grooves were related to the divergence of the vacancy concentration at grain boundaries, which induced Sn grain tilting or sliding. Removal of the grain boundaries in the single-crystal interconnect made surface diffusion the primary electromigration mechanism, resulting in wavy surface relief after long electromigration time. In Sn-Ag-Cu alloy, directional flow of Cu caused Cu6Sn5 IMC segregation, which produced large compressive stress, driving the stressed grains to grow into hillocks.
部门归属	[zhu, q. s.; liu, h. y.; wang, z. g.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;zhu, qs (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;qszhu@imr.ac.cn
关键词	Solder Interconnect Electromigration Hillock Grain Boundary Groove Joints Electromigration Whisker Copper Tin Cu
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/60541
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. S. Zhu,H. Y. Liu,Z. G. Wang,et al. Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading[J]. Journal of Electronic Materials,2012,41(4):741-747.
APA	Q. S. Zhu,H. Y. Liu,Z. G. Wang,&J. K. Shang.(2012).Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading.Journal of Electronic Materials,41(4),741-747.
MLA	Q. S. Zhu,et al."Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading".Journal of Electronic Materials 41.4(2012):741-747.