Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test

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	Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test
	Y. K. Zhu; Z. M. Yu; Y. S. Niu; W. J. Ding
	2012
发表期刊	Journal of Adhesion Science and Technology
ISSN	0169-4243
卷号	26 期号:10-11 页码:1645-1652
摘要	Multilayered Cu coatings were successfully obtained by introducing periodic ultrasonic agitation into an ordinary electroplating process. A so-called bidirectional bending test technique was proposed to assess the adhesive performance of electroplated Cu coatings to a substrate, in which the coated sample was bent in two directions, while the changes in the coating surface were observed. The critical cycle number for the sample, which corresponds to the start of detachment of the coating from the substrate, proved to be suitable for assessing the adhesion. A comparative study showed that the multilayered Cu coatings produced in this work, had much better adhesion than did ordinary Cu coatings. (C) Koninklijke Brill NV, Leiden, 2012
部门归属	[zhu, yongkui; yu, zhiming; niu, yunsong] chinese acad sci, inst met res, state key lab corros & protect, shenyang 110016, peoples r china. [zhu, yongkui; ding, wenjiang] shanghai jiao tong univ, sch mat sci & engn, shanghai 200030, peoples r china.;yu, zm (reprint author), chinese acad sci, inst met res, state key lab corros & protect, wenhua rd 72, shenyang 110016, peoples r china.;zmyu@imr.ac.cn
关键词	Multilayered Cu Coatings Adhesion Performance Bidirectional Bend Test Periodic Ultrasonic Wave The Critical Cycle Number Single
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/60542
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Y. K. Zhu,Z. M. Yu,Y. S. Niu,et al. Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test[J]. Journal of Adhesion Science and Technology,2012,26(10-11):1645-1652.
APA	Y. K. Zhu,Z. M. Yu,Y. S. Niu,&W. J. Ding.(2012).Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test.Journal of Adhesion Science and Technology,26(10-11),1645-1652.
MLA	Y. K. Zhu,et al."Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test".Journal of Adhesion Science and Technology 26.10-11(2012):1645-1652.