Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate

IMR OpenIR

	Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate
	H. F. Zou; Q. K. Zhang; Z. F. Zhang
	2012
发表期刊	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
ISSN	0921-5093
卷号	532 页码:167-177
摘要	It is well known that some discontinuous Bi particles and voids often appear at the interfaces for the SnBi/Cu couples, leading to the interfacial embrittlement during the thermo-aging procedure. In the current study, the experimental results confirmed that Bi segregation at the SnBi/Cu interface mainly originated from the Bi diffusion during reflowing and aging procedure. Small amounts of Ag, Al, Sn or Zn elements were deliberately added into the Cu substrate to restrain the interfacial Bi embrittlement of the SnBi/Cu couples. It does not only restrain the Bi segregation, but also eliminate the formation of voids at the interfaces. Besides, it is interesting to find that the addition of these elements above can significantly improve the mechanical properties of SnBi/Cu alloy joints even after long-term aging. Based on the experimental evidence, it is suggested that alloying Cu substrate is beneficial to the wide application of SnBi and other lead-free solders, and has the potential of being a common substrate in the electronic packaging field in the future. (C) 2011 Elsevier B.V. All rights reserved.
部门归属	[zou, h. f.; zhang, q. k.; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [zou, h. f.] capital aerosp machinery co, beijing 100076, peoples r china.;zhang, zf (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china.;zhfzhang@imr.ac.cn
关键词	Sn-bi Solder Void Cu3sn Bi Segregation Interfacial Embrittlement Cu Alloys Solder Interconnect Grain-boundaries Single-crystal Bismuth Embrittlement Segregation Copper Strength
URL	查看原文
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/60543
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,Q. K. Zhang,Z. F. Zhang. Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2012,532:167-177.
APA	H. F. Zou,Q. K. Zhang,&Z. F. Zhang.(2012).Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,532,167-177.
MLA	H. F. Zou,et al."Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 532(2012):167-177.