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题名: Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints
作者: J. Q. Chen;  J. D. Guo;  K. L. Liu;  J. K. Shang
发表日期: 2013
刊名: Journal of Applied Physics
相关网址: <Go to ISI>://WOS:000326117900021
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
J. Q. Chen,J. D. Guo,K. L. Liu,et al. Dependence Of Electromigration Damage On Sn Grain Orientation In Sn-ag-cu Solder Joints[J]. Journal Of Applied Physics,2013,114(15).

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