| Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints | |
| J. Q. Chen; J. D. Guo; K. L. Liu; J. K. Shang | |
| 2013 | |
| Source Publication | Journal of Applied Physics
 |
| ISSN | 0021-8979 |
| Volume | 114Issue:15 |
| Abstract | The relationship between the "polarity effect" of electromigration on interfacial intermetallic growth and the Sn grain orientation was investigated in Sn-Ag-Cu solder joints. The growth of the interfacial intermetallic compound was found to depend strongly on the Sn grain orientation. When the c-axes of the Sn grains were closely aligned to the current flow direction, a severe polarity effect was observed in which the anode interface was covered with a thick layer of Cu-Sn intermetallic while the intermetallic layer at the cathode interface was almost depleted. If the c-axes of the Sn grains were rotated away from the current direction, the polarity effect became less pronounced. When the c-axis was perpendicular to the current direction, the polarity effect essentially disappeared. The difference in the intermetallic layer thickness between the anode and the cathode, Delta d, followed a parabolic function of the cosine of the angle, a, between the c-axis and the current direction. A kinetic model based on the highly anisotropic diffusion behavior of Cu in Sn was presented to explain the relationship between the electromigration polarity effect and Sn-grain orientation. The model showed good agreement with the experimental data. (C) 2013 AIP Publishing LLC. |
| description.department | [chen, jian-qiang ; guo, jing-dong ; liu, kai-lang ; shang, jian-ku] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [shang, jian-ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa. ; guo, jd (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. ; jdguo@imr.ac.cn |
| Keyword | Intermetallic Compound Formation Diffusion Tin Interconnect Growth Metals Gold |
| URL | 查看原文 |
| Language | 英语 |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/71155 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | J. Q. Chen,J. D. Guo,K. L. Liu,et al. Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints[J]. Journal of Applied Physics,2013,114(15). |
| APA | J. Q. Chen,J. D. Guo,K. L. Liu,&J. K. Shang.(2013).Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints.Journal of Applied Physics,114(15). |
| MLA | J. Q. Chen,et al."Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints".Journal of Applied Physics 114.15(2013). |
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