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题名: Study of Tin Electroplating Process Using Electrochemical Impedance and Noise Techniques
作者: X. Q. Huang;  Y. Chen;  T. W. Fu;  Z. Zhang;  J. Q. Zhang
发表日期: 2013
刊名: Journal of the Electrochemical Society
相关网址: <Go to ISI>://WOS:000326905000064
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
X. Q. Huang,Y. Chen,T. W. Fu,et al. Study Of Tin Electroplating Process Using Electrochemical Impedance And Noise Techniques[J]. Journal Of The Electrochemical Society,2013,160(11):D530-d537.

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