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Study of Tin Electroplating Process Using Electrochemical Impedance and Noise Techniques
X. Q. Huang; Y. Chen; T. W. Fu; Z. Zhang; J. Q. Zhang
2013
Source PublicationJournal of the Electrochemical Society
ISSN0013-4651
Volume160Issue:11Pages:D530-D537
AbstractThe tin electroplating process was studied by means of electrochemical impedance and noise (EN) technique. Scanning electron microscopy (SEM) was used to investigate the morphology of tin electrodeposits. Electrochemical impedance results reveal that charge transfer resistance of tin electroplating decreases with the potential bias eta exponentially at this experimental condition. It is found that the EN generated at high current density has large potential oscillation amplitude and positive potential drift, while the EN show small noise amplitude at low current density. With the decrease of current density, the corresponding deposit changes from large conglomerate particles to compact. New parameters are proposed to cultivate the relationship between the EN feature and the structure of tin deposits. The variation trend of Parameter n(2) was found to be in accordance with the crystallite size. For different Sn2+ concentrations, the oscillation amplitude of the potential noise at low concentrations are much larger than that of high concentrations, which may be correlated with that tin electroplating process is coupled with hydrogen evolution at low Sn2+ concentrations. (C) 2013 The Electrochemical Society. All rights reserved.
description.department[huang, xianqiu ; chen, yu ; zhang, zhao ; zhang, jianqing] zhejiang univ, dept chem, hangzhou 310027, zhejiang, peoples r china. [huang, xianqiu] wuhan iron & steel co, res inst, wuhan 430080, peoples r china. [zhang, jianqing] state key lab corros & protect, shenyang 110015, peoples r china. ; huang, xq (reprint author), zhejiang univ, dept chem, yu quan campus, hangzhou 310027, zhejiang, peoples r china. ; eaglezzy@zjuem.zju.edu.cn
KeywordNanocrystalline Ingot Iron Electrodeposition Nucleation Deposition Corrosion Carbon Alloy Oxide
URL查看原文
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/71269
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
X. Q. Huang,Y. Chen,T. W. Fu,et al. Study of Tin Electroplating Process Using Electrochemical Impedance and Noise Techniques[J]. Journal of the Electrochemical Society,2013,160(11):D530-D537.
APA X. Q. Huang,Y. Chen,T. W. Fu,Z. Zhang,&J. Q. Zhang.(2013).Study of Tin Electroplating Process Using Electrochemical Impedance and Noise Techniques.Journal of the Electrochemical Society,160(11),D530-D537.
MLA X. Q. Huang,et al."Study of Tin Electroplating Process Using Electrochemical Impedance and Noise Techniques".Journal of the Electrochemical Society 160.11(2013):D530-D537.
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