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A New Crack Healing Kinetic Model and Application of Crack Healing Diagram
Y. Kan; H. Liu; S. H. Zhang; L. W. Zhang; M. Cheng
2013
Source PublicationJournal of Manufacturing Science and Engineering-Transactions of the Asme
ISSN1087-1357
Volume135Issue:5
AbstractAn internal crack is a common defect which can lead to failure of the material. There are few published studies which can quantitatively predict healed fractions under given conditions such as temperature, pressure and healing time. In the current study, a new crack healing kinetic model is developed to predict the healed crack fraction under any given temperature, pressure and healing time. In contrast to previous models, this new model describes the crack surface topography as a series of semi spherical pores, and proposes a new diffusion healing mechanism involving grain growth. Plastic deformation, power law creep and diffusion controlled creep mechanism are considered in this model. A crack healing diagram for 34MnV steel is constructed with axes of healed fraction and temperature or pressure. The predictions from the new model compare well with experimental results. The results of the model indicate that the diffusion controlled creep mechanism contributes little at high temperatures because of grain growth. The critical healing time and pressure can be determined by using the crack healing diagram.
description.department[kan, y. ; zhang, l. w.] dalian univ technol, sch mat sci & engn, dalian 116024, peoples r china. [kan, y. ; liu, h. ; zhang, s. h. ; cheng, m.] chinese acad sci, inst met res, shenyang 110016, peoples r china. ; ykan@imr.ac.cn ; hliu@imr.ac.cn ; shzhang@imr.ac.cn ; zhanglw@dlut.edu.cn ; mcheng@imr.ac.cn
KeywordCrack Healing Model Healing Diagram Crack Surface Topography Grain Growth Sintering Kinetics Numerical-analysis Diffusion Shrinkage Surface Grain
URL查看原文
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/71289
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Y. Kan,H. Liu,S. H. Zhang,et al. A New Crack Healing Kinetic Model and Application of Crack Healing Diagram[J]. Journal of Manufacturing Science and Engineering-Transactions of the Asme,2013,135(5).
APA Y. Kan,H. Liu,S. H. Zhang,L. W. Zhang,&M. Cheng.(2013).A New Crack Healing Kinetic Model and Application of Crack Healing Diagram.Journal of Manufacturing Science and Engineering-Transactions of the Asme,135(5).
MLA Y. Kan,et al."A New Crack Healing Kinetic Model and Application of Crack Healing Diagram".Journal of Manufacturing Science and Engineering-Transactions of the Asme 135.5(2013).
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