Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect

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	Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect
	H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang
	2013
发表期刊	Journal of Materials Science-Materials in Electronics
ISSN	0957-4522
卷号	24 期号:1 页码:211-216
摘要	Effects of electromigration on microstructure and tensile property were studied in the Sn-1Ag-0.5Cu and Sn-1Ag-0.5Cu-1Zn solder interconnects. While the polarity effect and strength reduction from electromigration occurred in the Sn-1Ag-0.5Cu solder interconnects, they were suppressed by the Zn addition in the Sn-1Ag-0.5Cu-1Zn solder interconnects. Such a strong effect of Zn was explained by the strong binding of Zn with Cu, which prevented the dissolution of the IMC at the cathode, and by the reverse migration of the Zn elements, which counteracted the increase in the vacancy concentration so that the strength reduction was successfully inhibited.
部门归属	[liu, h. y. ; zhu, q. s. ; wang, z. g. ; guo, j. d. ; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa. ; zhu, qs (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. ; qszhu@imr.ac.cn
关键词	Intermetallic Compound Formation Sn-3.8ag-0.7cu Solder Cu Microstructure Joints
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/71367
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	H. Y. Liu,Q. S. Zhu,Z. G. Wang,et al. Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect[J]. Journal of Materials Science-Materials in Electronics,2013,24(1):211-216.
APA	H. Y. Liu,Q. S. Zhu,Z. G. Wang,J. D. Guo,&J. K. Shang.(2013).Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect.Journal of Materials Science-Materials in Electronics,24(1),211-216.
MLA	H. Y. Liu,et al."Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect".Journal of Materials Science-Materials in Electronics 24.1(2013):211-216.