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Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect
H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang
2013
Source PublicationJournal of Materials Science-Materials in Electronics
ISSN0957-4522
Volume24Issue:1Pages:211-216
AbstractEffects of electromigration on microstructure and tensile property were studied in the Sn-1Ag-0.5Cu and Sn-1Ag-0.5Cu-1Zn solder interconnects. While the polarity effect and strength reduction from electromigration occurred in the Sn-1Ag-0.5Cu solder interconnects, they were suppressed by the Zn addition in the Sn-1Ag-0.5Cu-1Zn solder interconnects. Such a strong effect of Zn was explained by the strong binding of Zn with Cu, which prevented the dissolution of the IMC at the cathode, and by the reverse migration of the Zn elements, which counteracted the increase in the vacancy concentration so that the strength reduction was successfully inhibited.
description.department[liu, h. y. ; zhu, q. s. ; wang, z. g. ; guo, j. d. ; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa. ; zhu, qs (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. ; qszhu@imr.ac.cn
KeywordIntermetallic Compound Formation Sn-3.8ag-0.7cu Solder Cu Microstructure Joints
URL查看原文
Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/71367
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
H. Y. Liu,Q. S. Zhu,Z. G. Wang,et al. Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect[J]. Journal of Materials Science-Materials in Electronics,2013,24(1):211-216.
APA H. Y. Liu,Q. S. Zhu,Z. G. Wang,J. D. Guo,&J. K. Shang.(2013).Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect.Journal of Materials Science-Materials in Electronics,24(1),211-216.
MLA H. Y. Liu,et al."Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect".Journal of Materials Science-Materials in Electronics 24.1(2013):211-216.
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