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题名: Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect
作者: H. Y. Liu;  Q. S. Zhu;  Z. G. Wang;  J. D. Guo;  J. K. Shang
发表日期: 2013
刊名: Journal of Materials Science-Materials in Electronics
相关网址: <Go to ISI>://WOS:000313799400030
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
H. Y. Liu,Q. S. Zhu,Z. G. Wang,et al. Effects Of Zn Addition On Electromigration Behavior Of Sn-1ag-0.5cu Solder Interconnect[J]. Journal Of Materials Science-materials In Electronics,2013,24(1):211-216.

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