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题名: Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process
作者: P. J. Shang;  L. Zhang;  Z. Q. Liu;  J. Tan;  J. K. Shang
发表日期: 2013
刊名: Microelectronics Reliability
相关网址: <Go to ISI>://WOS:000320424800017
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
P. J. Shang,L. Zhang,Z. Q. Liu,et al. Ex Situ Observations Of Fast Intermetallic Growth On The Surface Of Interfacial Region Between Eutectic Snbi Solder And Cu Substrate During Solid-state Aging Process[J]. Microelectronics Reliability,2013,53(6):899-905.

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