Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries

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	Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries
	N. C. Sheng; J. D. Liu; T. Jin; X. F. Sun; Z. Q. Hu
	2013
发表期刊	Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science
ISSN	1073-5623
卷号	44A 期号:4 页码:1793-1804
摘要	The microstructural evolution and bonding behavior of transient liquid phase (TLP) bonded joints for single-crystal superalloy samples with a 300-mu m-wide gap have been investigated. The results show that at the initial stage, the interface grows with a cellular structure. With the increase of time, the length and numbers of the cellular structures decrease. At the final stage, the interface evolves with a planar manner. The gradient of B ahead of the liquid/solid interface exists and becomes sharper from the initial to the final analyzed from the electron probe microanalysis (EPMA) results. Inevitably, isolated grain forms during the evolution of the interface and the growth rate of isothermal solidification zone (ISZ) changes through the whole bonding process, and these both deviate from the traditional TLP bonding models. The mechanisms of the formation of the isolated grain boundaries and the reasons for the deviation of the solidification rate are discussed. Also, some effective methods to avoid the formation of isolated grain boundaries in the ISZ are proposed.
部门归属	[sheng, n. c. ; liu, j. d. ; jin, t. ; sun, x. f. ; hu, z. q.] chinese acad sci, inst met res, superalloys div, shenyang 110016, peoples r china. ; sheng, nc (reprint author), chinese acad sci, inst met res, superalloys div, shenyang 110016, peoples r china. ; tjin@imr.ac.cn
关键词	Inconel 738lc Superalloy Isothermal Solidification b System Transient Temperature Joint
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/71453
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	N. C. Sheng,J. D. Liu,T. Jin,et al. Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries[J]. Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science,2013,44A(4):1793-1804.
APA	N. C. Sheng,J. D. Liu,T. Jin,X. F. Sun,&Z. Q. Hu.(2013).Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries.Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science,44A(4),1793-1804.
MLA	N. C. Sheng,et al."Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries".Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science 44A.4(2013):1793-1804.