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Simulation of metastable corrosion pit development under mechanical stress
H. T. Wang; E. H. Han
2013
发表期刊Electrochimica Acta
ISSN0013-4686
卷号90页码:128-134
摘要A cellular automata model coupled with finite element method is used to describe metastable pitting corrosion growth and its transition to stability of stainless steel under mechanical stress. The model includes anodic dissolution, passivation, diffusion and hydrolysis of salt film. The local stress and strain distributions on the pit surface are analyzed by the finite element method in real time during the pit growth. The effects of local stress and strain on anodic current at every micro-region of the pit surface obtained by Gutman model are used as the boundary conditions for the cellular automata model. The result shows that the growth rate of metastable pitting corrosion under stress is far higher than that under no stress. The effects of rupture time and rupture extent of pit cover and diffusion of hydrogen ions on current transients under stress and no stress are analyzed. (c) 2012 Elsevier Ltd. All rights reserved.
部门归属[wang, haitao ; han, en-hou] chinese acad sci, state key lab corros & protect, inst met res, shenyang 110016, peoples r china. ; wang, ht (reprint author), chinese acad sci, state key lab corros & protect, inst met res, wencui rd 62, shenyang 110016, peoples r china. ; htwang@imr.ac.cn
关键词Metastable Pitting Corrosion Mechanoelectrochemical Simulation Cellular Automata Finite Element Method Stainless-steel Pitting Corrosion Crack Transition Growth Fatigue Dissolution Initiation Stability Automata Behavior
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语种英语
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/71528
专题中国科学院金属研究所
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GB/T 7714
H. T. Wang,E. H. Han. Simulation of metastable corrosion pit development under mechanical stress[J]. Electrochimica Acta,2013,90:128-134.
APA H. T. Wang,&E. H. Han.(2013).Simulation of metastable corrosion pit development under mechanical stress.Electrochimica Acta,90,128-134.
MLA H. T. Wang,et al."Simulation of metastable corrosion pit development under mechanical stress".Electrochimica Acta 90(2013):128-134.
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