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High-temperature thermal stability of nanocrystalline Cr2O3 films deposited on silicon wafers by arc ion plating
T. G. Wang; Y. M. Liu; H. Sina; C. M. Shi; S. Iyengar; S. Melin; K. H. Kim
2013
Source PublicationSurface & Coatings Technology
ISSN0257-8972
Volume228Pages:140-147
AbstractIn this work, the high-temperature thermal stability of nanocrystalline Cr2O3 films on Si wafers deposited at various bias voltages was systematically investigated by means of a symmetrical high-resolution thermogravimetric system. In the meantime, the effects of substrate bias voltage on the morphology, microstructure, crack area percentage, phase constituents, and grain size of the heat-treated Cr2O3 films were also studied in detail. The results showed that the Cr2O3 films presented the higher thermal stability in pure nitrogen than in air up to 1200 degrees C because the brittle oxidation product was more prone to cracking and chipping. As the bias voltage was -100 V, the Cr2O3 film showed the highest thermal stability which was attributed to its most compact structure and the lowest defect density. After the heat treatments, all the films cracked due to the big difference in thermal expansion coefficient between the Cr2O3 film and Si wafer, which caused large thermal stresses. And some obvious micro-cavities were left in the film cross section after oxidation owing to the vaporization of Cr2O3 in oxygen containing atmosphere. In addition, the heat treatment also had a strong influence on the grain size of the Cr2O3 films. Crown Copyright (C) 2013 Published by Elsevier B.V. All rights reserved.
description.department[wang, tie-gang ; sina, hossein ; iyengar, srinivasan ; melin, solveig] lund univ, div mat engn, se-22100 lund, sweden. [wang, tie-gang ; shi, changming] chinese acad sci, inst met res, state key lab corros & protect, shenyang 110016, peoples r china. [wang, tie-gang ; kim, kwang ho] pusan natl univ, natl core res ctr hybrid mat solut, pusan 609735, south korea. [liu, yanmei] chinese acad sci, inst met res, anal & testing div, shenyang 110016, peoples r china. ; wang, tg (reprint author), chinese acad sci, inst met res, state key lab corros & protect, shenyang 110016, peoples r china. ; tgwang@imr.ac.cn ; srini@material.lth.se
KeywordCr2o3 Film Arc Ion Plating Bias Voltage Thermal Stability Crack Area Percentage Grain Size Fatigue Crack Initiation Chromium-oxide Coatings P/m Super-alloys Thin-films Mechanical-properties Vapor-deposition Wear-resistance Crn Coatings Oxidation Microstructure
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Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/71556
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
T. G. Wang,Y. M. Liu,H. Sina,et al. High-temperature thermal stability of nanocrystalline Cr2O3 films deposited on silicon wafers by arc ion plating[J]. Surface & Coatings Technology,2013,228:140-147.
APA T. G. Wang.,Y. M. Liu.,H. Sina.,C. M. Shi.,S. Iyengar.,...&K. H. Kim.(2013).High-temperature thermal stability of nanocrystalline Cr2O3 films deposited on silicon wafers by arc ion plating.Surface & Coatings Technology,228,140-147.
MLA T. G. Wang,et al."High-temperature thermal stability of nanocrystalline Cr2O3 films deposited on silicon wafers by arc ion plating".Surface & Coatings Technology 228(2013):140-147.
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