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Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction
L. M. Yang; Z. F. Zhang
2013
Source PublicationJournal of Electronic Materials
ISSN0361-5235
Volume42Issue:12Pages:3552-3558
AbstractThe effects of Y2O3 nanoparticles doped in Sn-3Ag-0.5Cu solder on the growth behaviors of Cu6Sn5 grains in the soldering reaction with copper were investigated. It is found that the growth rate of Cu6Sn5 grains was markedly decreased due to the addition of Y2O3 nanoparticles. The statistical size distribution results indicated that Cu6Sn5 grains with radius less than the average value account for a high percentage. These results confirm that the nanoparticles can effectively suppress the diffusion behaviors of Cu atoms in the wetting reaction.
description.department[yang, l. m.] univ sci & technol china, hefei 230026, peoples r china. [yang, l. m. ; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [yang, l. m.] shenyang univ technol, dept phys, shenyang 110870, peoples r china. ; yang, lm (reprint author), univ sci & technol china, 96 jinzhai rd, hefei 230026, peoples r china. ; lmyang10b@imr.ac.cn ; zhfzhang@imr.ac.cn
KeywordLead-free Solder Intermetallic Compounds Interfacial Reaction Grain Growth Sn-ag-cu Shear-strength Mechanical-properties Rare-earth Bga Joints Alloy Electromigration Reliability
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Language英语
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/71631
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
L. M. Yang,Z. F. Zhang. Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction[J]. Journal of Electronic Materials,2013,42(12):3552-3558.
APA L. M. Yang,&Z. F. Zhang.(2013).Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction.Journal of Electronic Materials,42(12),3552-3558.
MLA L. M. Yang,et al."Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction".Journal of Electronic Materials 42.12(2013):3552-3558.
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