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题名: Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude
作者: Q. K. Zhang;  Z. F. Zhang
发表日期: 2013
刊名: Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
相关网址: <Go to ISI>://WOS:000322693800046
Appears in Collections:中国科学院金属研究所_期刊论文

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Recommended Citation:
Q. K. Zhang,Z. F. Zhang. Thermal Fatigue Behaviors Of Sn-4ag/cu Solder Joints At Low Strain Amplitude[J]. Materials Science And Engineering A-structural Materials Properties Microstructure And Processing,2013,580:374-384.

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